The Speedprint line of machines use squeegees and precisely laser cut stencils to ‘print’ solder paste on to a circuit board where surface mount components will be placed. The machine uses cameras and a fiducial correction system to ensure accuracy. Simple in design and function, these machines are simple to maintain, program and operate. The SP700 series stencil printers are designed to be effective in low, medium, or high volume surface-mount technology production operations. They provide the flexible solution ideal for high-mix, quick product set-up, and changeover environments.
The Universal ‘Fuzion®’ platform line of equipment are high speed pick and place machines. They use a vacuum system in conjunction with spindles and nozzles for high speed precision placement of components on circuit boards. Fuzion® uses a variety of sizes and types of nozzles to pick a wide range of surface-mount technology electronic components from numerous feeder types and place them on a circuit board. The fiducial correction system is capable of reading fiducials from multiple circuits on a board for pinpoint accuracy. The Fuzion® line includes the Fuzion120’s, capable of simultaneously running four 30 spindle rotary Lightning heads, and the Fuzion37’s, that use a 30 spindle Lightning head along with an Inline 7 head, for picking and placement of larger and oddly shaped parts.
The Advantis3™ combines the best in technology, performance, and unmatched scalability. The Advantis3™ machines are the little brother to the Fuzion® machines, running single 30 spindle Lightning heads. Upgraded with new style spindles for increased accuracy, they are used to add flexibility and speed to our placement lines. These machines feature powerful, flexible platforms that handle a wide range of applications and readily adapt to new ones.
The Pillarhouse International Orissa Synchrodex is a modular selective soldering system. It is designed to eliminate the need for hand soldering. The first module in the line is equipped with a precision drop jet fluxer and upper and lower preheat modules. The next two modules have bottom side preheat, a drop jet fluxer, and solder pot/pump/nozzle setups. The preheat helps with flux activation and raises the board temperature for better solder flow and reduced dwell time on the solder joints. All machines incorporate fiducial correction for increased accuracy. Having two soldering modules allows the soldering program to be split for increased flexibility and efficiency.
The Nordson Select Cerno 102 is a selective solder machine that uses a programmable system to eliminating the need for hand soldering. This is done by applying flux, then a fountain of molten solder from the underside to the leads of through-hole components, in order to solder them to a circuit board. The Cerno 102 is capable of using nozzles from 3mm in size to 25mm, and can run a 75mm ‘mini-wave’ nozzle. The adjustable pinpoint fluxing system ensures that the precise amount of flux is applied where it is needed. It uses fiducial correction for increased accuracy, and the conveyor system ensures a constant flow of product through the system.
The Vitronics Soltec XPM3m reflow ovens are used to bring circuit boards, that have had solder paste and components applied to them, up through a temperature that will first activate the flux, then reflow the solder between the circuit board and the components. A continuous conveyor system carries the boards through zones of increasing heat until they reach ‘reflow’ temperature, then through cooling zones. Our ovens are seven or eight zone ovens and are monitored for accuracy using a KIC oven profiling system. Their superior reliability has established a worldwide reputation. Their robust design combined with a heat-transfer system consistently delivers benchmark thermal performance, precise process control, and superior value for high production in a 24/7 environment.