Fuzion’s flagship platform
Fuzion® is Universal’s flagship platform, leveraging the latest generation of head and feeder technologies, and software tools for maximum performance. Fuzion solutions maximize utilization, Overall Equipment Effectiveness (OEE), and productivity while delivering the lowest cost per placement for any environment or product mix.
AdvantisV™ is a next-generation midrange platform that combines the best in technology and performance and unmatched scalability. The AdvantisV portfolio features powerful, flexible platforms that handle a wide range of applications and readily adapt to new ones.
The SP700 series SMT stencil printers have been designed to be perfectly at home in low, medium or high volume SMT production operations. Essentially they provide the flexible solution ideal for high-mix, quick product set-up and changeover environments.
The fluxer/preheat combo operates in tandem with the selective soldering unit. It can be configured with either Drop-Jet or ultrasonic flux heads and both top and bottom side IR preheat functions. Twin-pitch flux heads are available for further cycle time reductions.
The Vitronics Soltec XPM3m platform is the latest evolution in a long history of reflow systems. Their superior reliability has established a worldwide reputation. First, their robust design combined with a heat-transfer system consistently delivers benchmark thermal performance. Second, precise process control, and third, superior value for high production in a 24/7 environment.