WHAT WE DO

WORLD-CLASS CEM SERVICES
Ssurface Mount Technology

SURFACE MOUNT TECHNOLOGY

What we do…We believe that utilizing the latest technology is critical. The award-winning Fusion Platform and Advantis Platform from Universal Instruments gives us the latest technology in innovative SMT machines. Enabling us to print, place and re-flow components in a variety of sizes. For instance, we can print, place and re-flow components from <0201 to 44mm. Our annual multi-million placement accuracy statistics for first pass yield continues to grow.

THROUGH HOLE

Our selective solder through-hole systems position our clients for success. We reduce the risks of thermal shock and excessive flux contamination inherent to traditional systems. Fragile displays are handled easily with our systems. For instance, assembly of select solder components which are placed onto printed circuit boards, panels, and other assemblies will not disturb nearby SMT components. Therefore, what we do is offer the speed and flexibility of our systems to help our clients achieve repeatable success in their competitive market.

Through Hole
Advantis 3

MECHANICAL ASSEMBLY

Our mechanical assembly projects range from simple to complex. Each client requires something different. For example, affixing simple wire harnesses, to threaded, heat staked, chemically bonded, or other process methods. In conclusion, we assure a quality mechanical fit and function for the client’s project.