ADVANTIS3 PLATFORM
The Advantis3™ combines the best in technology, performance, and unmatched scalability. The Advantis3™ machines are the little brother to the Fuzion® machines, running single 30 spindle Lightning heads. Upgraded with new style spindles for increased accuracy, they are used to add flexibility and speed to our placement lines. These machines feature powerful, flexible platforms that handle a wide range of applications and readily adapt to new ones.
Fuzion® Platform
The Universal ‘Fuzion®’ platform line of equipment are high speed pick and place machines. They use a vacuum system in conjunction with spindles and nozzles for high speed precision placement of components on circuit boards. Fuzion® uses a variety of sizes and types of nozzles to pick a wide range of surface-mount technology electronic components from numerous feeder types and place them on a circuit board. The fiducial correction system is capable of reading fiducialsreference points from multiple circuits on a board for pinpoint accuracy. The Fuzion® line includes the Fuzion120’s, capable of simultaneously running four 30 spindle rotary Lightning heads, and the Fuzion37’s, that use a 30 spindle Lightning head along with an Inline 7 head, for picking and placement of larger and oddly shaped parts.
SPEED PRINT
The Speedprint line of machines use squeegees and precisely laser cut stencils to ‘print’ solder pasteTiny balls of solder mixed with flux on to a circuit board where surface mount components will be placed. The machine uses cameras and a fiducial reference points on printed circuit boards for mechanical equipment correction system to ensure accuracy. Simple in design and function, these machines are simple to maintain, program and operate. The SP700 series stencil printers are designed to be effective in low, medium, or high volume surface-mount technology production operations. They provide the flexible solution ideal for high-mix, quick product set-up, and changeover environments.
PILLAR HOUSE
The Pillarhouse International Orissa Synchrodex is a modular selective soldering system. It is designed to eliminate the need for hand soldering. The first module in the line is equipped with a precision drop jet fluxer'Highly accurate method of applying flux, resulting in minimal flux deposit and reducing the need for PCB cleaning.' - Pillarhouse and upper and lower preheat modules. The next two modules have bottom side preheat, a drop jet fluxer, and solder pot/pump/nozzle setups. The preheat helps with flux activation and raises the board temperature for better solder flow and reduced dwell time on the solder joints. All machines incorporate fiducial correction for increased accuracy. Having two soldering modules allows the soldering program to be split for increased flexibility and efficiency.
Cerno 102
The Nordson Select Cerno 102 is a selective solder machine that uses a programmable system to eliminating the need for hand soldering. This is done by applying fluxChemical cleaning agent,<br> flowing agent, or purifying agent<br> used before/during the soldering process., then a fountain of molten solder from the underside to the leads of through-hole components, in order to solder them to a circuit board. The Cerno 102 is capable of using nozzles from 3mm in size to 25mm, and can run a 75mm ‘mini-wave’ nozzle. The adjustable pinpoint fluxing system ensures that the precise amount of flux is applied where it is needed. It uses fiducial correction for increased accuracy, and the conveyor system ensures a constant flow of product through the system.
SCS Conformal Coating
Conformal coatings are generally thin, nonconductive, dielectric layers that are used to protect devices and components from damage due to contamination, salt spray, moisture, fungus, dust and corrosion. While conformal coatings were first used to protect military and aerospace applications, their use has expanded over the last 5 decades to include medical devices, consumer electronics, transportation electronics, and more. In recent years, the development of new materials and coating processes has enabled an even larger variety of items to be coated in production facilities around the world.
VITRONICS SOLTEC
The Vitronics Soltec XPM3m reflowSolder paste used to temporarily attach electrical components to their contact pads ovens are used to bring circuit boards, that have had solder paste and components applied to them, up through a temperature that will first activate the flux, then reflow the solder between the circuit board and the components. A continuous conveyor system carries the boards through zones of increasing heat until they reach ‘reflow’ temperature, then through cooling zones. Our ovens are seven or eight zone ovens and are monitored for accuracy using a KIC oven profiling system. Their superior reliability has established a worldwide reputation. Their robust design combined with a heat-transfer system consistently delivers benchmark thermal performance, precise process control, and superior value for high production in a 24/7 environment.
Radial 88HTi
The Radial 88HTi offers consistently high throughput regardless of component type, with single-, dual-, triple-, and quad-span insertion variants. Lead span capability up to 10mm virtually eliminates tedious manual assembly requirements to improve throughput, product quality and output per floor space, while reducing associated labor costs and time requirements to provide greater returns. The Radial 88HTi delivers exceptional flexibility with over 100 available inputs on the expandable sequencer. An intuitive operator interface that is common with other Generation 88HT equipment offers easy operation, diagnostics, data management and a graphical product editor.
AOI ScanSpection
Automated Optical Inspection – The economic realities of quality control, rework cost and need for customer confidence make Automated Optical Inspection (AOI) a necessity in Circuit Board manufacturing environments AOI can take a number of roles on the PCB production line. There are a number of “captive” applications such as accurate component positioning in the pick and place system, or screen checking in the paste printer, and there are also stand-alone functions to which AOI is ideally suited.
AOI Systems ScanSpection uses two basic algorithm groups to inspect component and soldering. The first algorithm checks the component related parameters at once, with these being entered to a Model training phase. The second algorithm group is for solder and lead inspection and offers the ability to use the optimum algorithm for the type of inspection to be carried out. In addition the solder inspection and lead inspection can be attached to a package type rather than component type to assist in programming.